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| Name | Value | 
|---|---|
| Product Status | Obsolete | 
| Type | PGA, ZIF (ZIP) | 
| Number of Positions or Pins (Grid) | 121 (11 x 11) | 
| Pitch - Mating | 0.100" (2.54mm) | 
| Contact Finish - Mating | Gold | 
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) | 
| Contact Material - Mating | Beryllium Copper | 
| Mounting Type | Through Hole | 
| Features | - | 
| Termination | Solder | 
| Pitch - Post | 0.100" (2.54mm) | 
| Contact Finish - Post | Gold | 
| Contact Finish Thickness - Post | 30.0µin (0.76µm) | 
| Contact Material - Post | Beryllium Copper | 
| Housing Material | Polyethersulfone (PES) | 
| Operating Temperature | -55°C ~ 150°C | 
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