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| Name | Value | 
|---|---|
| Product Status | Active | 
| Type | Solder Paste | 
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 
| Diameter | - | 
| Melting Point | 423 ~ 428°F (217 ~ 220°C) | 
| Flux Type | No-Clean | 
| Wire Gauge | - | 
| Mesh Type | 4 | 
| Process | Lead Free | 
| Form | Jar, 8.8 oz (250g) | 
| Shelf Life | 12 Months | 
| Shelf Life Start | Date of Manufacture | 
| Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) | 
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