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| Name | Value |
|---|---|
| Product Status | Active |
| Type | LGA |
| Number of Positions or Pins (Grid) | 257 (20 x 30) |
| Pitch - Mating | 0.039" (1.00mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 3.00µin (0.076µm) |
| Contact Material - Mating | Copper Alloy |
| Mounting Type | Surface Mount |
| Features | Board Guide, Open Frame |
| Termination | Solder |
| Pitch - Post | - |
| Contact Finish - Post | - |
| Contact Finish Thickness - Post | - |
| Contact Material - Post | - |
| Housing Material | Thermoplastic |
| Operating Temperature | -25°C ~ 100°C |
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