New Magnetic Packaging Technology for Power Modules: Reducing Power Module Size by 50%
These power modules utilize TI's proprietary MagPack integrated magnetic packaging technology, reducing size by up to 23 percent.
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These power modules utilize TI's proprietary MagPack integrated magnetic packaging technology, reducing size by up to 23 percent.
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RS1MB-13-F Alternative FSM17PL-TP-HF Micro Commercial Co Diode 1000 V 1A Surface Mount SOD-123FL
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ICHOME provides a one-stop purchasing solution, not only with rich product inventory, but also with professional electronic component quality testing services.
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